System in Package (SiP) is the processing of sensitive components into robust finished modules.  With more than 15 years' experience, Swissbit Germany successfully uses advanced packing technology such as Chip-on-Board (COB) and die stacking.

SiP is a microelectronic integration approach.  In order to provide more functionality inside the casing, various functional blocks (RF, digital, memory) are combined as uncased semiconductor chips, passive components, and further components in a casing (package).  This makes it possible for several components in a confined space to work with the independence of the individual components.

Moreover, vertical component integration along the Z axis can also occur with SiP.

If you cannot achieve the special demands regarding space requirements and performance using traditional components and processes, Swissbit is your ideal choice when choosing a memory vendor.  Swissbit will aid you from the time of inception of your project: from the design phase, prototyping either COB or SMT, determining the circuit layout and material selection, to preparing the appropriate packaging for transport.